Liquid sealing material for copper bump, and resin composition for use as same

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United States of America Patent

PATENT NO 10941280
APP PUB NO 20170335090A1
SERIAL NO

15528739

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Abstract

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Provided is a liquid sealing material for copper bumps which is inhibited from suffering filler separation during thermal curing and thereby causing bump cracking. Also provided is a resin composition for use as the sealing material. The resin composition according to the present invention comprises (A) a liquid epoxy resin, (B) a hardener, and (C) an alumina filler having a surface treated with the silane coupling agent of the following formula (1).

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATIONNIIGATA-SHI NIIGATA 950-3131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamazawa, Tomoya Niigata, JP 4 5
Yoshii, Haruyuki Niigata, JP 8 41

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