FILM-FORMING METHOD

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United States of America Patent

APP PUB NO 20170335454A1
SERIAL NO

15586488

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A film-forming method for forming a film in a film-forming apparatus includes generating first gas molecular species and second gas molecular species by causing the first source gas and the second source gas accumulated in the accumulation mechanisms to pass through respective instantaneously-heating units, sharply raising partial pressure of the first gas molecular species and partial pressure of the second gas molecular species by projectingly supplying the first gas molecular species and the second gas molecular species to the reaction chamber in which the substrate has been placed, which has been depressurized, and which has a constant capacity; bringing the first gas molecular species or the second gas molecular species into reaction by alternately repeatedly guiding the first gas molecular species or the second gas molecular species to a surface of the substrate, and forming a compound film on the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
PHILTECH INC5F YUSHIMA OHTA BLDG 2-29-3 YUSHIMA BUNKYO-KU TOKYO 113-0034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FURUMURA, Yuji Kanagawa, JP 42 1037
HAIKATA, Eri Tokyo, JP 4 10
ISHIKAWA, Masato Tokyo, JP 64 634
NISHIHARA, Shinji Tokyo, JP 55 778
SHIMIZU, Noriyoshi Tokyo, JP 139 1576

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