Method for producing through hole in floor system for pipe penetration and floor system using the same

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United States of America Patent

PATENT NO 10119632
APP PUB NO 20170335996A1
SERIAL NO

15672996

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Abstract

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The present invention provides a method for producing a through hole in a floor system for pipe penetration. The method includes providing a deck system with ridge portions and valley portions; creating a hollow on the deck system; providing a ring with at least one securing ear formed on a perimeter thereof; mounting the ring onto the deck system by jointing the at least one securing ear of the ring and the at least one of the ridge portions such that the ring is fixedly received in the hollow of the deck system; and fixedly receiving a pipe casing in the ring mounted on the deck system, wherein the pipe casing defines a path for the pipe penetration. The method further includes forming a concrete layer on the deck system to obtain a composite slab.

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International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Kuan-Lung New Taipei, TW 3 10

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