Method of producing a cap substrate, and packaged radiation-emitting device
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United States of America Patent
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May 7, 2019
Grant Date -
Nov 23, 2017
app pub date -
Jul 26, 2017
filing date -
Dec 3, 2013
priority date (Note) -
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Abstract
The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
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