Printed circuit board and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10154579
APP PUB NO 20170339781A1
SERIAL NO

15597686

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A first insulating layer is formed on a support substrate. The first insulating layer includes a first portion and a second portion. The second portion has a thickness smaller than that of the first portion. A ground layer having electric conductivity higher than that of the support substrate is formed on the second portion of the first insulating layer. The ground layer is electrically connected to the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer. A write wiring trace is formed on the second insulating layer to overlap with the first portion and the second portion of the first insulating layer.

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First Claim

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanabe, Hiroyuki Ibaraki, JP 83 468
Yamauchi, Daisuke Ibaraki, JP 25 95

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