APPARATUS AND METHOD FOR TREATING A SUBSTRATE
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United States of America Patent
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Nov 30, 2017
app pub date -
May 24, 2017
filing date -
May 26, 2016
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Abstract
Provided is a method for treating a substrate which removes particle within a concave portion on a substrate having a thin film on which a pattern having the concave portion on its upper surface is formed. The substrate treating method according the present invention comprises a penetration step for penetrating a treatment liquid containing supercritical organic chemical solution into the concave portion; and a heating step for heating the substrate after the penetration step.
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