Piezoelectric device, liquid ejecting head, manufacturing method of piezoelectric device, and manufacturing method of liquid ejecting device
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United States of America Patent
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Apr 30, 2019
Grant Date -
Nov 30, 2017
app pub date -
Nov 17, 2015
filing date -
Dec 9, 2014
priority date (Note) -
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Abstract
A piezoelectric device includes a first substrate that includes a piezoelectric element (32) provided in a first region where bending deformation is allowed and an electrode layer (39) electrically connected to the piezoelectric element (32), a second substrate in which a bump electrode (43) abutting and conducting the electrode layer (39), and having elasticity is formed, and which is disposed so as to face the piezoelectric element (32) with a predetermined space, and adhesive (43) that bonds the first substrate and the second substrate in a state where a distance between the first substrate and the second substrate is maintained. The adhesive (43) has a width in a center portion in a height direction relative to a surface of the first substrate or the second substrate greater than a width in end portions in the same direction.
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