Electronic component
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United States of America Patent
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Jul 16, 2019
Grant Date -
Nov 30, 2017
app pub date -
Apr 17, 2017
filing date -
May 26, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a multilayer body, a primary coil including an n-number primary coil conductor layers and one series coil conductor layer, a secondary coil including an n-number secondary coil conductor layers, and a tertiary coil including an n-number tertiary coil conductor layers. The arrangement includes one primary coil conductor layer, one secondary coil conductor layer, and one tertiary coil conductor layer in this order from a first side to a second side of a laminating direction. The series coil conductor layer is electrically connected in series to the n-number primary coil conductor layers and is provided at the second side of the laminating direction with respect to the tertiary coil conductor layer closest to the second side of the laminating direction.
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