WAFER LEVEL PACKAGING USING A TRANSFERABLE STRUCTURE
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United States of America Patent
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app pub date -
Feb 23, 2017
filing date -
May 31, 2016
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Abstract
According to various aspects and embodiments, a system and method for packaging an electronic device is disclosed. One example of the method comprises depositing a layer of temporary bonding material onto a surface of a first substrate, depositing a layer of structure material onto a surface of the layer of temporary bonding material, masking at least a portion of the structure material to define an unmasked portion and a masked portion of the structure material, exposing the unmasked portion of the structure material to a source of light, removing the masked portion of the structure material, bonding at least a portion of a surface of a second substrate to the unmasked portion of the structure material, and removing the first substrate from the unmasked portion of the structure material.
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