HIGH-K METAL GATE DEVICE AND MANUFATURING METHOD THEREOF

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United States of America Patent

SERIAL NO

15235155

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Abstract

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A high-k metal gate device and manufacturing method thereof are provided in the present invention. The method uses a silicon material layer as a battier layer for the lower silicon nitride layer in the NMOS region and then performs an annealing process to turn the silicon material layer into a TiSiN interlayer of the PMOS region and a TiSiN layer of the NMOS region, respectively. TiSiN material can prevent subsequent upper metal atoms from diffusing downward and improve the stability of the metal gate device. Additionally, the silicon material remained on the surface of the NMOS region is subsequently removed, thereby eliminating differences of the thickness of the residual silicon material layer and fluctuations of the threshold voltage of the NMOS region resulted from the differences thereof and further improving the stability of the NMOS device.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI HUALI MICROELECTRONICS CORPORATIONNO 6 LIANGTENG ROAD PUDONG NEW AREA SHANGHAI 201314

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
He, Zhibin Shanghai, CN 20 131
Jing, Xubin Shanghai, CN 4 5

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