Package structure of light emitter and light sensor with light-blocking layer and method for manufacturing the same
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United States of America Patent
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Jun 25, 2019
Grant Date -
Nov 30, 2017
app pub date -
May 25, 2017
filing date -
May 27, 2016
priority date (Note) -
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Abstract
A package structure and a method for manufacturing the same are disclosed. The package structure includes a first plastic body which covers a first light sensor and a light emitter, and a second plastic body which is made of infrared cutoff materials and fills inner pins of a lead frame or is formed below the lead frame. A trench is formed in the first plastic body so that a light-blocking layer is located on a side surface of the first plastic body. The second plastic body and the light-blocking layer are used to avoid influence of infrared light on a first light sensor.
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