PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A BOND PAD
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United States of America Patent
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Jun 7, 2016
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Jun 7, 2016
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Abstract
A process of forming an electronic device including providing a substrate having a first surface and a second surface opposite the first surface; etching the substrate along the first surface to define a trench; forming a via within the trench; applying a tape including an adhesive to the first surface, wherein the adhesive of the tape is spaced apart from the first surface by a distance; and operating on the second surface of the substrate.
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