HEAT PIPE ASSEMBLY AND HEAT PIPE STRUCTURE
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United States of America Patent
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app pub date -
Nov 2, 2016
filing date -
Jun 4, 2016
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Abstract
A heat pipe assembly adapted to an electronic device is provided. The heat pipe assembly includes at least one heat pipe, a bracket, and at least one fixing member. The heat pipe is disposed in a body of the electronic device. The bracket is assembled to a portion of the heat pipe, and positions and suspends the heat pipe in the housing. The fixing member is fixed to the bracket by penetrating the housing from an exterior of the housing, such that the bracket and the housing are fixed to each other. A heat pipe structure is also provided.
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