ASSEMBLING DEVICE USED FOR SEMICONDUCTOR EQUIPMENT
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United States of America Patent
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Issued Date -
Dec 14, 2017
app pub date -
May 30, 2017
filing date -
Jun 8, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is directed to an assembling device used for semiconductor equipment. The assembling device includes a chamber lid, a ceiling, a suspension part and a driving part. The ceiling is disposed below the chamber lid. The suspension part is inserted through the chamber lid, and to be hooked to the ceiling. The driving part is disposed above the chamber lid and connected to the suspension part, and configured to drive the suspension part to join or separate the ceiling and the chamber lid. The driving part has an elevating unit and a rotating unit. The elevating unit and the rotating unit are respectively configured to elevate and rotate the suspension part.
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