Component carrier and method to produce said component carrier

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10716201
APP PUB NO 20170359889A1
SERIAL NO

15616717

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Abstract

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The invention relates to a component carrier for an electronic device, the component carrier comprising at least one heat-releasing component that is embedded within at least one carrier layer of the component carrier, and wherein the at least one embedded heat-releasing component is thermoconductively coupled to a heat spreader layer, characterized in that the heat spreader layer forms at least an outside section of a casing of said electronic device. Also an electronic device that comprises at least one component carrier according to the invention, as well as a method to produce a respective component carrier are indicated.

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Patent Owner(s)

Patent OwnerAddress
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT8700 LEOBEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Hyung Wook Trofaiach, AT 11 15

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