Method and System for Processing a Circuit Substrate
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United States of America Patent
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Jun 14, 2016
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Jun 14, 2016
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Abstract
An array of ultraviolet light emitting diodes can cure ultraviolet curable material, such as solder mask or ink, that has been applied to a substrate in connection with fabricating electronic circuit devices. The substrate can be placed in a housing associated with a processing station of a manufacturing operation. A mask or stencil can be positioned adjacent the substrate. The ultraviolet curable material can be applied to the substrate via the mask or stencil, for example using a squeegee. The ultraviolet light emitting diodes can be moved over the substrate to cure the ultraviolet curable material. The substrate with the cured material can be removed from the housing.
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