Importance

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Abstract

An endoscope device includes: an imaging unit including a semiconductor chip including an image sensor formed thereon, and a protective glass adhered on the image sensor with an adhesive layer; and a holder configured to hold the imaging unit by fitting the protective glass therein. The semiconductor chip includes: a light-receiving section; a peripheral circuit section; a guard ring surrounding the light-receiving section and the peripheral circuit section; and a plurality of metal dots formed on an outer circumference of the guard ring. The protective glass is adhered to the semiconductor chip by the adhesive layer so as to cover the light-receiving section, the peripheral circuit section, the guard ring, and the metal dots, and the metal dots are formed at a same interval from the outer circumference of the guard ring to a connection end portion of a connecting surface between the semiconductor chip and the protective glass.

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First Claim