Method and structures for heat dissipating interposers
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United States of America Patent
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Oct 16, 2018
Grant Date -
Dec 21, 2017
app pub date -
Jun 19, 2017
filing date -
Dec 19, 2012
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Abstract
An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.
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