HEARING DEVICE WITH EMBEDDED DIE STACK
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United States of America Patent
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Jun 16, 2016
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Jun 16, 2016
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Abstract
Described herein are methods and apparatus in which two integrated circuit dies are stacked and embedded in a printed circuit board (PCB) substrate. In one embodiment, the two dies are stacked directly on top of one another with and electrically connected with through-silicon-vias (TSVs). The interconnect routing between the two die occurs within the TSVs and die level redistribution layer (RDL) routing. The resulting die stack can then be embedded into a single layer of the PCB substrate rather than in two separate layers.
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