ASSEMBLY FOR THE FULL-SURFACE ADHESIVE BONDING OF SUBSTANTIALLY CONGRUENT ADHESIVE-BONDING SURFACES OF A FIRST AND A SECOND JOINING PARTNER

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United States of America Patent

SERIAL NO

15543453

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Abstract

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The invention relates to an assembly for adhesively connecting substantially congruent gluing surfaces of a first and second joining partner over their full surface, comprising: the first joining partner (1); the second joining partner (2); an adhesive layer (3) of a polar, flowable adhesive applied to the gluing surface (1a) of the first joining partner (1); means (8) for holding the second joining partner (2) above the adhesive layer (1a) of the first joining partner (1), such that the gluing surface (2a) of the second joining partner (2) faces the adhesive layer (3) on the first joining partner (1) and is disposed so as to be spaced therefrom across an air gap (5), and the spacing defined by the air gap (5) between the first joining partner (1) and the second joining partner (2) is dimensioned in such a way that a capillary volume is formed; means (7) for generating an electric field (10) in order to cause, by means of electric influence, a local charge displacement (11) on and/or in the second joining partner (1), and the charge displacement (11) is suitable for attracting the polar adhesive in such a way that it wets the gluing surface (2a) of the second joining partner (2) first in the area of the local charge displacement (11), wherein the means for generating the electric field comprise an electrode (7), which is disposed on the side of the second joining partner (2) facing away from the gluing surface (2a) and is electrically insulated from said partner (2).

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Patent Owner(s)

Patent OwnerAddress
PREH GMBHSCHWEINFURTER STR 5-9 BAD NEUSTADT A D SAALE 97616

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MARTIN, Michael Unsleben, DE 146 1632

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