MEMS device, liquid ejecting head, manufacturing method of MEMS device, and manufacturing method of liquid ejecting head
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United States of America Patent
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Apr 30, 2019
Grant Date -
Dec 28, 2017
app pub date -
Jun 20, 2017
filing date -
Jun 28, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.
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