POLYAMIC ACID, POLYIMIDE, POLYIMIDE FILM AND COPPER CLAD LAMINATE USING THE SAME
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United States of America Patent
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Apr 26, 2017
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Jun 23, 2016
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Abstract
A polyamic acid as a polymer of a dianhydride monomer and a diamine monomer is disclosed. The dianhydride monomer is an aromatic tetrabasic carboxylic acid dianhydride monomer. The diamine monomer comprises a diamine monomer containing pyrimidinyl and an aromatic diamine monomer. A polyimide, a polyimide film and a copper clad laminate using the polyamic acid are also provided.
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