Wafer holding apparatus and baseplate structure
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United States of America Patent
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-
Nov 24, 2020
Grant Date -
Dec 28, 2017
app pub date -
Jun 12, 2017
filing date -
Jun 27, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.
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