REFLOW ENHANCEMENT LAYER FOR METALLIZATION STRUCTURES
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United States of America Patent
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app pub date -
Jun 22, 2016
filing date -
Jun 22, 2016
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Abstract
A reflow enhancement layer is formed in an opening prior to forming and reflowing a contact metal or metal alloy. The reflow enhancement layer facilitates the movement (i.e., flow) of the contact metal or metal alloy during a reflow anneal process such that a void-free metallization structure of the contact metal or metal alloy is provided.
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