Biconvex low resistance metal wire

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United States of America Patent

PATENT NO 10170419
APP PUB NO 20170373006A1
SERIAL NO

15189720

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Abstract

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At least one opening having a biconvex shape is formed into a dielectric material layer. A void-free metallization region (interconnect metallic region and/or metallic contact region) is provided to each of the openings. The void-free metallization region has the biconvex shape and exhibits a low wire resistance.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adusumilli, Praneet Albany, US 163 782
Reznicek, Alexander Troy, US 1406 11120
van, der Straten Oscar Guilderland Center, US 172 870

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