Inter-plane offset in backside contact via structures for a three-dimensional memory device

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United States of America Patent

PATENT NO 9917093
SERIAL NO

15195446

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Abstract

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A three-dimensional memory device includes a plurality of planes, each having a respective alternating stack, strings of memory stack structures which extends through the respective alternating stack, and backside contact via structures vertically extending through the respective alternating stack, extending generally along the first horizontal direction, and laterally separating neighboring pairs of strings of memory stack structures along a second horizontal direction. A first plane includes a first plurality of strings that are laterally spaced apart along the second horizontal direction by a first plurality of backside contact via structures. A second plane laterally shifted from the first plane along the first horizontal direction and including a second plurality of strings that are laterally spaced apart along the second horizontal direction by a second plurality of backside contact via structures which are laterally offset with respect the first plurality of backside contact via structures along the second horizontal direction.

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Patent Owner(s)

  • SANDISK TECHNOLOGIES LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Cheng-Chung Milpitas, US 11 211
Higashitani, Masaaki Cupertino, US 272 4632
Ito, Fumitoshi Yokkaichi, JP 48 762
Pachamuthu, Jayavel San Jose, US 111 4527
Pham, Tuan San Jose, US 85 2258

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