Method of selectively transferring semiconductor device
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United States of America Patent
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Jun 23, 2020
Grant Date -
Dec 28, 2017
app pub date -
Aug 22, 2017
filing date -
Jul 29, 2013
priority date (Note) -
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Abstract
A method of transferring multiple semiconductor devices from a first substrate to a second substrate comprises the steps of forming the multiple semiconductor devices adhered on the first substrate, wherein the multiple semiconductor devices comprises a first semiconductor device and a second semiconductor device, and the first semiconductor device and the second semiconductor device have a first gap between thereof; separating the first semiconductor device and the second semiconductor device from the first substrate; sticking the first semiconductor device and the second semiconductor device to a surface of the second substrate, wherein the first semiconductor device and the second semiconductor device have a second gap between thereof; wherein the first gap and the second gap are different.
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