Thermal interface material structures

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United States of America Patent

PATENT NO 10182514
APP PUB NO 20170374759A1
SERIAL NO

15193186

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Abstract

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In an example, a thermal interface material (TIM) structure is disclosed. The TIM structure includes a first thermal interface material layer and a second thermal interface material layer. The second thermal interface material layer at least partially overlaps the first thermal interface material layer.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoffmeyer, Mark K Rochester, US 60 351
Mann, Phillip V Rochester, US 92 271

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