Chip parts
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United States of America Patent
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-
Jul 7, 2020
Grant Date -
Jan 4, 2018
app pub date -
Sep 13, 2017
filing date -
May 16, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.
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