Substrate, semiconductor package including the same, and method for manufacturing the same
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United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Jun 22, 2017
filing date -
Jun 29, 2016
priority date (Note) -
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Abstract
A substrate includes a dielectric layer having a first surface and a second surface opposite to the first surface, a first circuit layer and at least one second conductive element. The first circuit layer is disposed adjacent to the first surface of the dielectric layer, and includes at least one trace and at least one first conductive element connected to the trace. The first conductive element does not extend through the dielectric layer. The second conductive element extends through the dielectric layer. An area of an upper surface of the second conductive element is substantially equal to an area of an upper surface of the first conductive element.
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