MULTI-AXIS FLATTENING TOOL AND METHOD

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United States of America Patent

APP PUB NO 20180005855A1
SERIAL NO

15201057

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multi-axis flattening tool and method are described. In an example, the multi-axis flattening tool includes a support structure to constrain a bowed wafer along a support perimeter, and a pair of flattening structures independently movable relative to the support structure. For example, a first flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a first plane, and a second flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a second plane orthogonal to the first plane. The multi-axis bending of the wafer may flatten the wafer.

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Patent Owner(s)

Patent OwnerAddress
SUNPOWER CORPORATION51 RIO ROBLES SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sewell, Richard Hamilton Los Altos, US 44 131

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