SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

15636671

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present disclosure provides a semiconductor device including: a semiconductor chip including a circuit having a predetermined function, at least one first terminal connected to the circuit, and plural second terminals not connected to the circuit, the first and second terminals being formed along one edge of the semiconductor chip; plural third terminals provided at positions outside of the semiconductor chip and opposing the one edge, each of the plural third terminals being connected to one of the plural second terminals by a respective first wire; and an electronic component provided between the semiconductor chip and the third terminals, the electronic component including a fourth terminal that is connected to the first terminal by a second wire and is disposed below some of the first wires, wherein the first terminal is disposed at a position such that the first and second wires do not intersect.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
LAPIS SEMICONDUCTOR CO LTDKANAGAWA COUNTY YOKOHAMA JAPAN YOKOHAMA-SHI KANAGAWA

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MINESAKI, FUJIYUKI KANAGAWA, JP 3 3

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation