Circuitized substrate with electronic components mounted on transversal portion thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10068839
APP PUB NO 20180005934A1
SERIAL NO

15342619

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuitized substrate for mounting at least one electronic component having a plurality of terminals. The circuitized substrate includes a first portion of electrical insulating material embedding a first electric circuit for coupling a first subset of the terminals. The first electric circuit including one or more patterned conductive layers of electrically conductive material extending parallel to a plane of the circuitized substrate. The circuitized substrate further includes a second portion of electrically conductive material. One or more insulating elements of electrical insulating material cross the second portion transversally to the plane to insulate a plurality of conductive elements thereof for coupling a second subset of the terminals. One or more auxiliary components of the electronic component are mounted on the second portion. Each auxiliary component having a first terminal and a second terminal coupled with a first one and a second one, respectively, of a pair of the conductive elements.

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Patent Owner(s)

  • IBM CORPORATION

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brunschwiler, Thomas J Thalwil, CH 57 856
Gerke, Sebastian Klingnau, CH 4 4
Oggioni, Stefano Sergio Besana in Brianza, IT 26 215

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