SUBSTRATE WITH SUB-INTERCONNECT LAYER
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United States of America Patent
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app pub date -
Jul 2, 2016
filing date -
Jul 2, 2016
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Abstract
Electrical interconnect technology for a package substrate is disclosed. A substrate can include a first conductive element at least partially disposed in a first routing layer, and a second conductive element at least partially disposed in a second routing layer. The first and second routing layers are adjacent routing layers. The substrate can also include a third conductive element having first and second portions disposed in the first routing layer, and an intermediate third portion disposed in a “sub-interconnect layer” between the first and second routing layers.
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