Sensor chip stack and method of producing a sensor chip stack

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United States of America Patent

PATENT NO 10243017
APP PUB NO 20180006074A1
SERIAL NO

15636545

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Abstract

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The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material.

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Patent Owner(s)

  • AMS INTERNATIONAL AG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fitzi, Andreas Staefa, CH 17 45
Kraft, Jochen Bruck an der Mur, AT 35 100
Parteder, Georg Gleisdorf, AT 9 4
Schrank, Franz Graz, AT 59 322
Troxler, Thomas Erlenbach, CH 7 14

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