Multi-pack and component connectivity detection
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United States of America Patent
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May 28, 2019
Grant Date -
Jan 4, 2018
app pub date -
Jun 30, 2016
filing date -
Jun 30, 2016
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Techniques for enabling multi-pack and component connectivity detection are provided. In some configurations, individual PCMs can test the connectivity between components of a device without the need to operate the components. For example, PCMs configured in accordance with the present disclosure can test the connectivity between a motherboard, a display circuit, a camera, and a number of battery packs without the need to operate the motherboard, display circuit, camera, etc. In some configurations, conductors that are part of cables and connectors used to connect the components can be used to determine the state of one or more connections. When a signal that runs through the conductors meets one or more criteria, the PCMs of a device cause a predetermined delay prior to enabling one or more components. By testing the connectivity between components before each component transitions to an operational state, other problems caused by faulty connections can be mitigated.
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