Thermal flow meter

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9933292
APP PUB NO 20180017422A1
SERIAL NO

15653360

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710. Since thickness of a resin of the thin portion 4710 is small, the stress to be generated is small, and a force applied to the circuit package 400 can be reduced.

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First Claim

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Patent Owner(s)

  • HITACHI AUTOMOTIVE SYSTEMS, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doi, Ryosuke Hitachinaka, JP 56 233
Hanzawa, Keiji Hitachinaka, JP 127 1101
Morino, Takeshi Hitachinaka, JP 77 440
Tashiro, Shinobu Hitachinaka, JP 66 276
Tokuyasu, Noboru Hitachinaka, JP 99 1202
Uenodan, Akira Hitachinaka, JP 52 93

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