Camera module and method for the production thereof

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United States of America Patent

PATENT NO 10154184
APP PUB NO 20180020140A1
SERIAL NO

15548144

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A camera module includes a circuit carrier, an image sensor chip arranged on the circuit carrier and an optics module with an optics housing accommodating a lens. Provision is made for the optics housing to be embodied with at least three press-fit pins, the optics housing to be connected to the circuit carrier by way of the three press-fit pins with a predetermined distance from the circuit carrier, wherein the circuit carrier is embodied with at least three press-fit holes for establishing a press-fit connection by the press-fit pins. Furthermore, the invention relates to a method for producing the camera module.

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First Claim

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Patent Owner(s)

  • CONTI TEMIC MICROELECTRONIC GMBH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Werthessen, Boris Weißensberg, DE 3 9

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