Method for manufacturing a circuit

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United States of America Patent

PATENT NO 10701810
APP PUB NO 20180020555A1
SERIAL NO

15714188

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Abstract

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A method for manufacturing a circuit, in particular of a hearing aid, in which method a printed circuit board is made available with a first region and with a second region which are separated by means of a boundary. A component is mounted on the printed circuit board, wherein the component is positioned on the boundary. The first region is covered by means of a mask which has an edge, wherein the edge is positioned on the component, and the printed circuit board is provided with a coating. The coating is cut away in the region of the component and the mask is removed.

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Patent Owner(s)

Patent OwnerAddress
SIVANTOS PTE LTD18 TAI SENG STREET 08-08 18 TAI SENG SINGAPORE 539775

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beyfuss, Stefanie Erlangen, DE 14 29
Freels, Bjoern Erlangen, DE 6 16
Kral, Holger Fuerth, DE 35 206
Kuhn, Johannes Nuremberg, DE 13 62

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