Apparatus and Method for Cleaning Wafer Handling Equipment

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20180021818A1
SERIAL NO

15649471

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.

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Patent Owner(s)

Patent OwnerAddress
KLA-TENCOR CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Estrin, Val San Jose, US 1 0
Jong, Eric Mountain View, US 1 0
VanHoomissen, William San Jose, US 3 4

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