Apparatus and method for cleaning wafer handling equipment
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United States of America Patent
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Dec 13, 2022
Grant Date -
Jan 25, 2018
app pub date -
Jul 13, 2017
filing date -
Jul 25, 2016
priority date (Note) -
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Abstract
A cleaning assembly for cleaning one or more wafer edge handling contact surfaces of wafer handling equipment includes a substrate and a cleaning ring. The substrate includes an edge portion that extends about the body of the substrate. The cleaning ring is reversibly attachable to the edge portion of the substrate. The cleaning ring is formed from a deformable material. The substrate and cleaning ring are sized for compatibility with a front opening unified pod (FOUP) or a wafer cassette of a semiconductor fabrication facility.
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