Method of monitoring a dressing process and polishing apparatus

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United States of America Patent

PATENT NO 10675731
APP PUB NO 20180021920A1
SERIAL NO

15721211

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.

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Patent Owner(s)

  • EBARA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shinozaki, Hiroyuki Tokyo, JP 120 2244

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