MEMS jetting structure for dense packing

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United States of America Patent

PATENT NO 10696047
APP PUB NO 20180022093A1
SERIAL NO

15722155

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Abstract

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A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM DIMATIX INC109 ETNA ROAD LEBANON NH 03766

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bibl, Andreas Los Altos, US 271 12094
Essen, Kevin von San Jose, US 21 217
Hoisington, Paul A Hanover, US 151 2386

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