Methods of detecting faults in real-time for semiconductor wafers
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United States of America Patent
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Oct 23, 2018
Grant Date -
Jan 25, 2018
app pub date -
Jul 19, 2016
filing date -
Jul 19, 2016
priority date (Note) -
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Abstract
Systems for and methods of detecting faults in semiconductor wafers are provided. One method includes, for instance: monitoring, with at least one sensor, a recipe for manufacturing a semiconductor wafer; tracking, with a fault detection system, a set of steps for the recipe; determining a start of a step; sensing a set of data related to at least one parameter of the step; generating, by an imaging system, an image of the set of data; displaying, on a display, the image of the set of data; calculating, by the fault detection system, a pixel area ratio from the image of the set of data; determining if a fault exists in the wafer based upon the pixel area ratio; and displaying, on the display, an indication of the fault during real-time and at an end of the step.
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