Methods and apparatus for rapidly cooling a substrate
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United States of America Patent
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Jun 4, 2019
Grant Date -
Jan 25, 2018
app pub date -
Oct 2, 2017
filing date -
Apr 11, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Methods and apparatus for changing the temperature of a substrate are provided. In some embodiments, a method includes: placing a substrate onto a support surface of a substrate support disposed within an inner volume of a cooling chamber; moving at least one of the substrate support or a plate disposed in the cooling chamber opposite the substrate support from a first position, in which the substrate is placed onto the support surface, to a second position, in which a second volume is created between the support surface and the plate, the second volume being smaller than and substantially sealed off from a remaining portion of the inner volume; flowing a gas into the second volume to increase a pressure within the second volume; and flowing a coolant through a plurality of channels disposed in at least one of the substrate support or the plate to cool the substrate.
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