Power Conversion Device Including Semiconductor Module Provided with Laminated Structure

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United States of America Patent

SERIAL NO

15654858

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Abstract

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A power conversion device includes a semiconductor module with switching elements incorporated therein, a plurality of components electrically connected to the semiconductor module, and a laminated cooler provided with a plurality of cooling plates. A laminate is constituted by laminating at least the plurality of cooling plates and the semiconductor module, at least one among the plurality of cooling plates constituting the laminate is a large area cooling plate in which s projected area when viewed from the stacking direction is larger than the other cooling plate, and at least one of the components is a specific arrangement component which, when viewed from the stacking direction, is arranged in a specific position which overlaps the large area cooling plate, and, when viewed from a direction orthogonal to the stacking direction, overlaps with the laminate.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATION1-1 SHOWA-CHO KARIYA-CITY AICHI-PREF 448-8661

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MOMOSE, Taijiro Kariya-city, JP 5 6

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