WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded Component on Leadframe and Method Therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jul 19, 2016
filing date -
Jul 19, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A quad flat no lead package is provided comprising at least one first integrated circuit die embedded in a recess in a die paddle of a metal leadframe and a second integrated circuit chip die attached to the at least one first integrated circuit die wherein the first and second integrated circuit dies are electrically connected to each other and wherein the second integrated circuit die is connected to leads of the leadframe through copper pillars.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully