Simultaneous formation of liner and metal conductor

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United States of America Patent

PATENT NO 10128186
APP PUB NO 20180025971A1
SERIAL NO

15437639

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Abstract

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An integrated circuit device having a substrate including a dielectric layer is patterned with a set of conductive line trenches. Each conductive line trench of the conductive line pattern having parallel vertical sidewalls and a horizontal bottom. A metal fills the set of conductive line trenches, wherein the metal fill is created by an anneal and reflow process. A liner which is an alloy of the metal and a selected element formed at interfaces of the metal layer and a surface of the dielectric, created simultaneously with the metal fill by the anneal and reflow process.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edelstein, Daniel C White Plains, US 301 6007
Yang, Chih-Chao Glenmont, US 1030 7498

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