Semicondcutor structure and semiconductor manufacturing process thereof
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United States of America Patent
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Aug 28, 2018
Grant Date -
Jan 25, 2018
app pub date -
Jul 20, 2016
filing date -
Jul 20, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor structure has an integrated circuit component, a conductive contact pad, a seal ring structure, a conductive via, a ring barrier, and a mold material. The conductive contact pad is disposed on and electrically connected with the integrated circuit component. The seal ring structure is disposed on the integrated circuit component and surrounding the conductive contact pad. The conductive via is disposed on and electrically connected with the conductive contact pad. The ring barrier is disposed on the seal ring structure. The ring barrier surrounds the conductive via. The mold material covers side surfaces of the integrated circuit component. A semiconductor manufacturing process is also provided.
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