Board and electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10264673
APP PUB NO 20180027654A1
SERIAL NO

15613427

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A board includes a substrate having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other. And an electronic device includes a board having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other.

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First Claim

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Patent Owner(s)

  • FUJITSU LIMITED

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baba, Shunji Yokohama, JP 100 925
Kanda, Takashi Kawasaki, JP 105 842

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